Perbandingan komposisi material dalam limbah pcb ponsel blackberry, nokia, sony ericsson, dan huawei = Comparison of material composition of pcb waste on blackberry, nokia, sony ericsson, and huawei

Juniartha, A. A. G. (2013) Perbandingan komposisi material dalam limbah pcb ponsel blackberry, nokia, sony ericsson, dan huawei = Comparison of material composition of pcb waste on blackberry, nokia, sony ericsson, and huawei. Bachelor thesis, Universitas Pelita Harapan.

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Abstract

Teknologi merupakan sesuatu yang tidak akan pernah lepas dari kehidupan manusia dan akan terus berkembang untuk membantu manusia dalam beraktivitas. Ponsel merupakan salah satu teknologi yang dapat dikatakan merupakan kebutuhan pokok manusia sehingga muncul banyak teknologi pada ponsel yang membuat ponsel lama akan ditinggalkan oleh pemiliknya. Tingginya jumlah ponsel yang tidak dipergunakan kembali menyebabkan meningkatnya jumlah limbah elektronik yang berbahaya bagi lingkungan. Limbah elektronik membutuhkan metode yang tepat untuk proses daur ulangnya agar tidak mencemarkan lingkungan. Penelitian terhadap metode recovery material dari limbah elektronik khususnya PCB telah dilakukan sebelumnya, antara lain oleh Soenarta (2011) dan Kurniawan (2011) sehingga pada penelitian ini akan lebih spesifik untuk membandingkan komposisi material dari PCB ponsel beberapa produsen yang ada yaitu Blackberry, Nokia, Sony Ericsson, dan Huawei. Proses karakterisasi yang dilakukan pada penelitian ini dimulai dari proses collecting, proses disassembly, proses milling, proses pemisahan material berdasarkan densitas, dan yang terakhir adalah proses pemisahan logam tembaga. Untuk dapat mengetahui karakterisasi material dari PCB ponsel, dilakukan uji Energy Dispersive Spectrometry (EDS) serta didukung pula dengan uji Atomic Absorption Spectroscopy (AAS). Untuk PCB ponsel Huawei, fraksi beratnya didominasi oleh tembaga sebesar 49% serta fraksi ringannya didominasi oleh nitrogen sebesar 33%. PCB ponsel Sony Ericsson, fraksi berat dan ringannya didominasi oleh aluminium sebesar 39% dan 38%. PCB ponsel Blackberry didominasi oleh tembaga sebesar 64% pada fraksi beratnya dan aluminium sebesar 39% pada fraksi ringannya. PCB ponsel Nokia, fraksi berat dan ringannya didominasi oleh aluminium sebesar 37% dan 45%. / Technology is something that will never be separated from human life and will always evolve to support human activities. Cell phone is one example of the technologies which now can be considered as basic needs for human being. A lot of improvement appears in cell phone and make human abandoned their old cell phone. The increasing of old cell phone cause more electronic waste appears that can hazardous for the environment. Electronic waste requires a right method in the recycling process so it cannot pollute the environment. Researches of material recovery methods from electronic waste especially on circuit board have been done so many times before, including by Soenarta (2011) and Kurniawan (2011) so this research will focus to see the material composition of PCB waste from several manufacturers including Blackberry, Nokia, Sony Ericsson, and Huawei. The process in this research starts with collecting process, disassembly process, milling process, material separation based on density, and the last is copper separation process. To know the material character from cell phone PCB, Energy Dispersive Spectrometry (EDS) test was done and was supported by Atomic Absorption Spectroscopy (AAS) test. For the Huawei PCB, the heavy fraction is dominated by copper (49%) and the light fraction is dominated by nitrogen (33%). For the Sony Ericsson PCB, both of the heavy and the light fraction are dominated by aluminum (39% and 38% respectively). The Blackberry PCB is dominated by copper (64%) in the heavy fraction and aluminum (39%) in the light fraction. For the Nokia PCB, both the heavy and the light fraction are dominated by aluminum (37% and 45% respectively).

Item Type: Thesis (Bachelor)
Creators:
CreatorsNIMEmail
Juniartha, A. A. G.UNSPECIFIEDUNSPECIFIED
Contributors:
ContributionContributorsNIDN/NIDKEmail
Thesis advisorJobiliong, EricUNSPECIFIEDUNSPECIFIED
Thesis advisorHanafi, JessicaUNSPECIFIEDUNSPECIFIED
Uncontrolled Keywords: PCB; Material; Huawei; Sony Ericsson; Blackberry; Nokia; Circuit board
Subjects: T Technology > T Technology (General) > T55.4-60.8 Industrial engineering. Management engineering
Divisions: University Subject > Current > Faculty/School - UPH Karawaci > Faculty of Science and Technology > Industrial Engineering
Current > Faculty/School - UPH Karawaci > Faculty of Science and Technology > Industrial Engineering
Depositing User: Mr Samuel Noya
Date Deposited: 29 Nov 2018 04:27
Last Modified: 26 Feb 2019 06:34
URI: http://repository.uph.edu/id/eprint/2211

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